As AI chips have increasingly higher requirements for performance and integration, advanced packaging and substrate technologies have become crucial in semiconductor competition.Samsung Electro-Mechanics is reportedly bu...

In order to meet the needs of data analysis in various fields, AMD has recently launched a series of EPYC 3000 and AMD Ryzen V1000 two embedded processor products. Among them, in the field of industrial embedded computer...

Hua Hong Semiconductor Co., Ltd. today announced the successful mass production of its second-generation 90-nm G2 eFlash process platform with enhanced technical strength and competitiveness.

Linghua Technology, the world's leading provider of edge computing platform, announced the launch of the new embedded fanless computer MVP-5000, which carries the sixth generation Intel Core processor, computing performance beyond the previous generation processor 30%